Intermolecular, Inc. (IMI) insider have most recently took part in a trading activity. On Jun 22, 2017 Miller Lloyd I Iii, 10% Owner bought 80,000 shares having total worth of $70,400 at the price of $0.88 per share, following the transaction a total of 5,139,184 shares owned by Miller Lloyd I Iii. Before this latest buy, Miller Lloyd I Iii purchased IMI at 10 other times during the past twelve months, for a total investment of $72,826 at an average of $0.85 per share.
The stock has experienced a total of 10 insider trades in the past three months. These trades include 10 buy trades. Furthermore, over the past 12 months , the stock was traded 18 times by insiders. In 2 of these trades, the insider was a seller while an employee of the company was the buyer in 16 instances.
|Time Frame||Number of Insider Buy||Number of Insider Sell||Stock Price Change(%)|
Shares of Intermolecular, Inc. (IMI) traded up 10.48% on Jun 22, 2017, hitting $0.97. 117,561 shares of the company’s stock traded hands. Intermolecular, Inc. has a 52 week low of $0.8 and a 52 week high of $2.83. The company’s market cap is $50 million.
Intermolecular, Inc. (IMI) last announced its earnings results on May 4, 2017. The company reported -0.10 earnings per share (EPS) for the quarter, lower than the consensus estimate of -0.08 by $0.02. The company had revenue of $10 million for the quarter, compared to the consensus estimate of $10 million. During the same quarter in the previous year, the company posted -0.01 earnings per share. The company’s revenue for the quarter was down 31% on a year-over-year basis.
|earnings per share||-0.10||-0.05||-0.12||-0.06||-0.01||-0.02||-0.10||-0.08||-0.10||-0.11|
Intermolecular, Inc. was originally incorporated as The BEP Group, Inc. in Delaware in June 2004. In November 2004, it changed its name to Intermolecular, Inc. It redefines R&D for the semiconductor and clean energy sectors as they develop new generations of technology for the communications, consumer electronics, medical device, automotive, and entertainment industries. Through paid collaborative development programs (CDPs) with its customers, it develops proprietary technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. This technology enables its customers to bring application-specific, customized, high-volume manufacturing-ready integrated devices to market faster and with less risk than traditional approaches to research and development (R&D). The Company provides its customers with proprietary technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. The Company’s proprietary approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy-efficient technologies. Its approach consists of its proprietary high productivity combinatorial (HPC) platform, coupled with its multi-disciplinary team. The Company’s HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. Its platform is purpose-built for R&D using combinatorial process systems, a methodology for discovery and development that employs parallel and other high-throughput experimentation and allows R&D to be performed at speeds 10 to 100 times faster than traditional methods. It currently targets large, high-volume semiconductor and high-growth emerging clean-energy markets, including DRAM, flash memory, complex logic, flat glass, solar cells, LEDs and other energy-efficient technologies. The Company’s largest customers are ATMI, Elpida Memory, GLOBALFOUNDRIES, Guardian Industries, SanDisk, Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba. It uses its Tempus HPC processing tools to rapidly process different experiments consisting of various combinations of materials, processing parameters, sequencing and device structures. The Company uses automated characterization systems to characterize the substrates processed by its Tempus HPC processing tools, thereby rapidly generating experimental data while matching its processing throughput. It uses its informatics and analysis software to automate experiment generation, characterization, data analysis and reporting, in each case while matching its processing throughput, and to create an aggregated and searchable database of information that includes the experimental results it generates.
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